With the global demand for high-precision semiconductor manufacturing equipment on the rise, the need for reliable and precise motion control components has become increasingly critical. In particular, the probing card clamping positioning platform, a key component in wafer testing systems, requires highly accurate and stable actuation to ensure the integrity of micro-scale electrical connections.
Modern probing platforms are typically composed of linear modules, servomotors, and high-precision positioning systems, all of which demand a robust and efficient gear reduction solution. As the industry moves toward miniaturization and higher throughput, the traditional designs are being challenged in terms of compactness, thermal stability, and long-term reliability.
Key challenges in the industry include:
- High positioning precision and repeatability
- Compact and modular design to fit into tight equipment enclosures
- High torque density for robust operation in high-speed testing environments
- Low backlash to ensure accurate signal transmission
- Long lifecycle and minimal maintenance to reduce downtime and cost
- Compatibility with cleanroom and high-temperature environments
